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This chapter gives a state-of-the-art review of many books and papers to help the readers understand the basics of the performance and application of microelectromechanical systems The authors considered in the review are 1 Michalicek, MA, Introduction to Microelectromechanical Systems, Air Force Research Laboratory, New Mexico, 2000 2 Hsu, TR, MEMS and Microsystems Design and Manufacture, McGraw Hill, 2002 3 MacDonald, NC, Microelectromechanical Systems (MEMS) Paradigms, Cornell University MEMS is the acronym for Micro Electro Mechanical Systems In Europe, MEMS are more commonly known as microsystems [1] MEMS can generally be defined as highly miniaturized devices or arrays of devices combining electrical and mechanical components, such as sensors, valves, actuators or complete systems, which are fabricated by using integrated circuit (IC) batch-processing techniques [2] Typically, MEMS contain components of sizes ranging from 1 micrometre ( m) to 1 millimetre (mm) For comparison purposes, Figure 81 shows a MEMS device (gear) alongside a human hair which is of a size of about 100 m [3] From the name itself, it can be understood that MEMS is able to achieve engineering functions through electromechanical means The current MEMS technology also incorporates thermal, magnetic, electrochemical, fluidic and optical devices Basically, the first effort to spur innovative miniature fabrication techniques for micromechanics was made by Richard Feynman in 1959 [4] However, his efforts failed to generate a fundamentally new fabrication technique In 1969, Westinghouse created the resonant gate Field-Effect Transistor (FET) based on new microelectronics fabrication techniques [2] Bulk-etched silicon wafers were used as pressure sensors in the 1970s, while the early experiments on surface-micromachined polysilicon were started in the 1980s The microelectronics industry enjoyed a great progress in the

47.3.1.4 Venting. Oven venting is required to remove harmful fumes from the oven tunnel. If there is too little venting, fumes will not be removed effectively. Too much exhaust will pull in room air through the tunnel entrance, tunnel exit, or both, which can disturb thermal performance. If nitrogen is being introduced to lower oxygen levels, too strong an exhaust draw will negate the effect of the nitrogen or make it difficult to control the oxygen level within the oven. For a more detailed look at venting, see Sec. 47.3.2. 47.3.1.5 Cooling. Just as important as heating the solder, the solder must be brought back to solid state before the board is handled. Otherwise, components sitting in liquid solder could move. Also, as a material such as solder solidifies and crystallizes, mechanical motion can perturb the lattice structure. The resultant solder joints may be of poorer quality and lesser reliability. Some ovens rely upon passive cooling, whereas others have active cooling elements such as fans or even chillers (fans blowing over chilled radiators).

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4732 Forced-Convection Reflow Oven This is the preferred tool for controlled and reliable reflow soldering dependent on heated air recirculated at high velocity in the oven tunnel The only direct irradiation of the PCBs is by the longest IR wavelengths emitted by the hot surfaces within the tunnel 47321 Forced-Convection Reflow Module Heating is accomplished primarily through heated air streams directed at the PWB s top and bottom surfaces This method imparts greater thermal uniformity and controllability of the reflow process than any other reflow oven heating methods It precludes overheating of the circuit board and/or components caused by preferential absorption common to direct IR heating methods Although the combination IR-convective method has helped in this regard, it is no substitute for the hot-air forced-convection technology Top-of-the-line forced-air-convection ovens have heating modules mounted above and below the board conveyor.

They accomplish heating by passing a high-velocity air stream drawn from the tunnel ambient over resistance heaters, through perforated platens The heating elements are typically shielded from the board to mitigate the effects of any direct or indirect IR impingement on the circuit board The high-velocity air flows are baffled and regulated to impart a uniform temperature across the tunnel width Each module is quickly heated and highly controllable Several heating modules are set side by side along the length of the oven It is typical to duplicate the forced-convection module array on the bottom of the oven tunnel to impart controllability of the reflow time-temperature profile and to help in even heating of the board from both sides simultaneously Fig 476 depicts this arrangement 47322 Cooling Some ovens rely upon passive cooling to lower the temperature of the PCB assembly below the solder liquidus point.

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