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Often the ramp is recommended in the range of 1 4 C per sec Additionally, some solders like Sn-Ag-Cu (SAC) require cooling rates in this range to allow for quick solidification and to discourage solder alloy segregation Cooling too slowly encourages redistribution of alloy constituents and silver platelets, or needles can form that may detract from solder-joint strength 47323 Venting An often overlooked reflow oven subsystem is exhaust venting This is most important from an industrial hygiene point of view, but it can also have a profound effect on the soldering process itself During the soldering process, minute quantities of metal oxides accumulate in the oven atmosphere or coat oven tunnel surfaces The dangers of prolonged exposure to microquantities of lead (Pb) or lead compounds are well documented.

With the change to Pb-free materials, the risks are likely lower, but there should still be concern for inhalation of any metal particulates As previously discussed, during reflow, solder paste volatilizes and releases paste reaction products Since most solder pastes and fluxes are highly guarded proprietary formulations, the paste and flux vendors may neither accurately disclose the composition reagents nor report the decomposition products in the mandated Material Safety Data Sheet (MSDS) Additionally, if a PCB should fall off the pin-chain conveyor or a component should fall through the mesh belt, it may land on a high-temperature surface either the heater itself ,or, in the case of forced-air convection reflow machines, the perforated baffles above the heater assembly Either the board or a plastic component will overheat, decompose, and release unpleasant or even dangerous fumes A properly designed and implemented exhaust system will mitigate these hazards.

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Figure 6.12 Block diagram for a crude analog-to-digital converter using the on-chip comparator on an AVR processor.

A high-velocity exhaust may influence oven performanceToo much exhaust will cause a significant net flow of atmosphere through the ovenThis can result in unwanted turbulence within the oven, upsetting intentional forced-convection patterns and making temperature regulation more difficult, reducing zone-to-zone influence (zone separation), decreasing ease of profile establishment, and resulting in process variability Some ovens are set with one central exhaust flue, whereas others may be designed to have ports at both the tunnel entrance and exit A dedicated manometer or other vent sensor should be installed in each exhaust line to monitor setup and routine exhaust performance Blast gates in the exhaust line permit flow adjustment It is customary to mount vent sensors after the flow damping device Follow oven manufacturer s guidelines for exhaust requirements.

Microelectronics have allowed further Fig 81: Comparison of a MEMS device with a strand of hair and blood cells [4] developments in the area of MEMS The boom in microelectromechanical systems would not have been possible without the advancement of microelectronics technology Therefore, before going into detail on MEMS, it will be beneficial to have some basic knowledge on the advances in the field of microelectronics Early works by Ferdinand Braun and Gugeilmo Marconi led to a further development in electronics [5] The invention of vacuum tubes led to the invention of the first computer in 1947 This was followed by the fabrication of the first transistor by John Bardeen, Walter Brattain and William Shockley who shared the Nobel Prize for their invention in 1956 The concept of MEMS was first put forward in 1958 by Jack Kilby with the invention of Integrated Circuits (ICs) which consist of a large number of individual components (transistors, resistors and capacitors) fabricated side by side on a common substrate and wired together to perform a particular circuit function The component counts per unit area for ICs double every two years while the feature size reduces, which allows an increase in complexity Figure 82 shows Moore s Law, named after Gordon Moore, a co-founder of Intel [4] The idea of ICs was further developed to incorporate a mechanical function to fabricate MEMS Microsystems and microelectronics share many common fabrication technologies In fact, microfabrication is often attributed to have led to the invention of the transistors and integrated circuits (ICs) Although there are similarities, the differences between the two are also worth discussing The significant differences are summarized by Hsu [6] as follows: When compared to microelectronics, microsystems involve materials that are more different Microsystems are designed to perform a greater variety of functions than microelectronics Microsystems involve moving parts such as microvalves, pumps and gears Integrated circuits primarily have a two-dimensional structure, but most microsystems involve a complicated three-dimensional geometry.

Since the exhaust gases are laden with volatile materials, mostly from the solder paste, active exhaust systems should be checked routinely for performance Impeller blades can foul.

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