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When using ovens set up for Sn-Pb soldering, there are five areas that the process engineer must pay attention to when making the move to Pb-free reflow 473351 Heater Robustness Check with the reflow oven manufacturer to ensure that the heater and fan assemblies (heater modules) will be compatible with the rigors of the higher oven temperatures associated with Pb-free reflow Although an oven may be able to reach the higher temperatures, the heater modules may degrade or fail as a result of running close to their maximum rated output 473352 Over-Temperature Sensors Most good reflow ovens are equipped with bi-metallic switches or other over-temperature sensors to prevent catastrophic overheating of heater modules induced by a broken or faulty thermocouple or failing thermal control circuitry.

Microsystems need to be in contact with the working media through sensing elements, whereas microelectronic devices are typically isolated from the surroundings Packaging technology for microelectronics is relatively well established, whereas microsystems technology is in its infancy

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When an oven is set up for Sn-Pb soldering, lower temperature bi-metallic switches are incorporated than when an oven is set up for Pb-free soldering The lower temperature bi-metallic switches may trip the oven heater circuitry when used with the higher temperatures necessary for achieving Pb-free reflow This will be most apparent in the highest temperature zone Check with reflow equipment manufacturer that the bi-metallic switches in an older oven will be compatible with the higher-temperature regimes of Pb-free soldering 473353 Firmware In some older reflow ovens, the computer control heater firmware does not allow the heater modules to be set high enough for Pb-free reflow If the rest of the oven is compatible for Pb-free soldering, check that heater modules are settable for the higher peak temperatures required of Pb-free soldering A firmware upgrade may be necessary 473354 Seals and Others.

Check with the reflow oven manufacturer that soft seals and other oven components in older reflow equipment will be compatible with the higher temperatures of Pb-free soldering 473355 Vent Stack Since vent gases are much hotter when running with most Pb-free solders (due to the higher melting point or melting range of these solders), ensure that all elements of the venting system are compatible with this increase in temperature This is particularly necessary closest to the oven itself, where vent stack gases are hottest Check flexible vent ducts, duct seals, flexible vent stack couplings, and stack monitors (manometers, velocimeters, etc) to ensure that they are compatible or not overheating 4734 Elements of Reflow The reflow time-temperature profile is of greatest importance in the oven soldering process.

It is the relationship of temperature with respect to time required to bring a PCB assembly to solder liquidus and back to solidus before exiting the oven 47341 Profile Dependencies The solder paste composition, circuit board lay-up (number of layers, board material), component types, component count, and the number of components per unit area on the board will dictate or influence reflow profile characteristics Oven performance such as heating characteristics (number of heater zones and responsiveness of each module) will dominate the process and profile Although the requirements of the in use determine each profile, how well the profile is maintained depends on the materials to be reflowed, the heating characteristics, repeatability health of process equipment, and the attention to detail by the process engineer..

Figure 6.13 A linear and an exponential plot for a small input range. This plot gives an idea of the amount of nonlinearity between the count accumulated using the simple RC charging scheme and the ideal count.

47.3.4.2 Solder. The solder alloy chosen dictates the peak temperature and time required for reflow and wetting. It may also influence the post-reflow cooling rate chosen, as some solders, especially Pb-free compositions, have preferred cooling ramps. 47.3.4.3 Flux and Other Solder Paste Components. As discussed previously, solder paste is typically composed of three main ingredients: solder alloy, flux, and other materials added to help with rheological properties critical for solder paste printing on the PWB. As mentioned, the solder alloy dictates the peak temperature regime, whereas the flux and other constituents dictate the pre-reflow heating ramp rate. Heating too rapidly may prematurely dry out solder paste components. Overly rapid heating may cause the solder paste to spatter. Too little heat may not allow proper activation of the flux. There is no universal profile recipe for reflow for a given solder alloy. The solder paste manufacturer will provide guidance for the time-temperature profile for each solder paste formulation. The reflow characteristics should be consistent from batch to batch for a given paste formulation.

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